Modeling and Thermal Analysis of Micro Beam Using Comsol Multiphysics


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Ülkir O., Ertuğrul İ., Girit O. , Ersoy S.

Thermal Science, cilt.2021, ss.80-85, 2021 (SCI Expanded İndekslerine Giren Dergi)

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 2021
  • Basım Tarihi: 2021
  • Doi Numarası: 10.2298/tsci200529005u
  • Dergi Adı: Thermal Science
  • Sayfa Sayıları: ss.80-85

Özet

In this study, the design and analysis of the micro beam is carried out using COMSOL Multiphysics. The current passing through the beam distributes the heat energy due to its resistance that pushes the entire micro beam to the desired distance through thermal expansion. This expansion varies depending on the amount of current passing through the beam and the emitted temperature. The purpose of the model created is to estimate the amount of current and temperature increase required to cause displacement in the proposed micro beam using analysis software. In addition, displacements and temperature data produced in micro beams for different metallic materials (aluminum, copper, nickel, and platinum) and different input potentials (0.3V, 0.6V and 0.9V) are reported. These materials are used as functional materials in the field of micro-electro-mechanical-system (MEMS) because of their important physical and electrical properties. As a result of the simulation studies, increasing the voltage increased the displacement in the materials and the resulting temperature. While there is a serious difference between the displacement data of the materials, the temperatures are close to each other. When 0.9V voltage is applied, the highest displacement values for aluminum, copper, nickel and platinum are; 7.88 μm, 5.36 μm, 3.62 μm, and 2.72 μm, respectively. As a result, it has been observed that aluminum used in micro beam design gives a significant amount of displacement for the proposed geometry when compared to other metallic beams.