15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, (EuroSimE), Ghent, Belçika, 7 - 09 Nisan 2014
This paper investigates transient heat transfer between a heated spring probe and its air environment. A continuum finite volume simulation is used to analyze of heat flow within and from the resistively heated probe to its environment. Experimental results are conducted for spring probe with laminar air flow and without air flow. The numerical results and experimental results are compared and very good agreement is observed.