Characterisation of electroplated NiMn films for wafer probing


Tunaboylu B. , Theppakuttai S.

MICRO & NANO LETTERS, cilt.7, sa.1, ss.45-48, 2012 (SCI İndekslerine Giren Dergi) identifier identifier

  • Cilt numarası: 7 Konu: 1
  • Basım Tarihi: 2012
  • Doi Numarası: 10.1049/mnl.2011.0588
  • Dergi Adı: MICRO & NANO LETTERS
  • Sayfa Sayıları: ss.45-48

Özet

Reliability in wafer test is critical for sort yield and the probe life is key to sort the floor performance. Probes made of Ni-alloys are becoming common as increasing parallelism and fine pitch requirements in test transform probe cards into microelectromechanical system products. NiMn probes, with a composition of 0.25 wt% Mn and good spring properties, were developed for high-cycle wafer probe applications. Mechanical properties of electroplated layers were investigated as a function of annealing conditions. A film release process was developed without the use of a sacrificial layer. Microstructural evolution on the film release interface was examined for two different substrates.