Reliability in wafer test is critical for sort yield and the probe life is key to sort the floor performance. Probes made of Ni-alloys are becoming common as increasing parallelism and fine pitch requirements in test transform probe cards into microelectromechanical system products. NiMn probes, with a composition of 0.25 wt% Mn and good spring properties, were developed for high-cycle wafer probe applications. Mechanical properties of electroplated layers were investigated as a function of annealing conditions. A film release process was developed without the use of a sacrificial layer. Microstructural evolution on the film release interface was examined for two different substrates.