Application of DMAIC Methodology in Semiconductor Manufacturing for Yield Improvement


Çeliktaş A., Alımlı D., Haymour M., TUNABOYLU B.

International Symposium for Production Research, ISPR 2023, Antalya, Türkiye, 5 - 07 Ekim 2023, ss.262-274 identifier

  • Yayın Türü: Bildiri / Tam Metin Bildiri
  • Doi Numarası: 10.1007/978-3-031-53991-6_20
  • Basıldığı Şehir: Antalya
  • Basıldığı Ülke: Türkiye
  • Sayfa Sayıları: ss.262-274
  • Anahtar Kelimeler: 5S, Cycle Time, DMAIC, KPI, Lean 6 Sigma, NVA, Poka-Yoke, Semiconductor, SMED
  • Marmara Üniversitesi Adresli: Evet

Özet

In the highly competitive semiconductor manufacturing industry, optimizing yield is of utmost importance for improving profitability and maintaining a competitive edge. This case study explores the successful application of the Six Sigma methodology to enhance yield and overall process efficiency within a semiconductor research laboratory in single line semiconductor manufacturing. Semiconductor manufacturing industry has successfully utilized the Six Sigma methodology by utilizing sufficient data and proper understandings of the Six Sigma approach. In this paper, we aim to discuss integrating of the Six Sigma methodology, specifically through the define, measure, analyze, improve, and control (DMAIC) phases, can address these issues effectively. By detailing the steps involved in this integration, enhance the overall process performance and capability, reduce cycle time, improve rolled throughput yield, and lower operating costs can be enhanced. Ultimately, this integration will lead to a quicker and more precise implementation of the Six Sigma methodology, eliminating the need for additional time and cost in sourcing data and significantly improving project outcomes.