Cooling analysis and innovative design to increase heat transfer in sealed electronic devices

Tarhan C. M., FEYZİOĞLU A., Brenner G.

Journal of Mechatronics and Artificial Intelligence in Engineering, 2025 (Hakemli Dergi)

• Yayın Türü: Makale / Tam Makale
• Basım Tarihi: 2025
• Doi Numarası: 10.21595/jmai.2025.25166
• Dergi Adı: Journal of Mechatronics and Artificial Intelligence in Engineering
• Marmara Üniversitesi Adresli: Evet