Reducing waste and increasing yield in roll-to-roll printing: a case study with global scalability


Pingale R. R., Altay B. N.

International Journal of Advanced Manufacturing Technology, cilt.141, sa.7-8, ss.4139-4153, 2025 (SCI-Expanded, Scopus) identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 141 Sayı: 7-8
  • Basım Tarihi: 2025
  • Doi Numarası: 10.1007/s00170-025-16931-8
  • Dergi Adı: International Journal of Advanced Manufacturing Technology
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, IBZ Online, Compendex, INSPEC, DIALNET
  • Sayfa Sayıları: ss.4139-4153
  • Anahtar Kelimeler: Condition-based maintenance (CBM), Control charts, DMAIC, OEE, Optimization, Roll-to-roll printing, Statistical process control (SPC), Sustainability, Waste reduction
  • Marmara Üniversitesi Adresli: Hayır

Özet

Roll-to-roll (R2R) printing suffers substantial substrate material losses during splicing, start-ups, and register stabilization, directly reducing yield and profitability. This study applied a Statistical Process Control (SPC) framework integrated with Define–Measure–Analyze–Improve–Control (DMAIC) methodology to reduce substrate material waste in high-speed printing production. Key interventions include condition-based maintenance of tension-critical components, adoption of thin “all-in-one” metallic splicing tapes, and optimized start-up sequences involving ink feed calibration, camera timing, and make-ready speed adjustments. Statistical analysis confirmed a significant yield increase from 219 to 222 pages/kg, validated through t-tests and control charts. The improvements generated annualized savings of $1.07 million USD per printing plant without increasing variability. Beyond economic gains, the reduced substrate use also lowered energy demand, water consumption, and associated emissions, demonstrating strong sustainability co-benefits. The results highlight SPC-DMAIC as a scalable model for continuous improvement in R2R operations, with direct applicability to package and publication printing, flexible packaging, printed electronics, and other web-based manufacturing processes.