Characterisation of electroplated NiMn films for wafer probing


Tunaboylu B. , Theppakuttai S.

MICRO & NANO LETTERS, vol.7, no.1, pp.45-48, 2012 (Journal Indexed in SCI) identifier identifier

  • Publication Type: Article / Article
  • Volume: 7 Issue: 1
  • Publication Date: 2012
  • Doi Number: 10.1049/mnl.2011.0588
  • Title of Journal : MICRO & NANO LETTERS
  • Page Numbers: pp.45-48

Abstract

Reliability in wafer test is critical for sort yield and the probe life is key to sort the floor performance. Probes made of Ni-alloys are becoming common as increasing parallelism and fine pitch requirements in test transform probe cards into microelectromechanical system products. NiMn probes, with a composition of 0.25 wt% Mn and good spring properties, were developed for high-cycle wafer probe applications. Mechanical properties of electroplated layers were investigated as a function of annealing conditions. A film release process was developed without the use of a sacrificial layer. Microstructural evolution on the film release interface was examined for two different substrates.