Akademik Veri Yönetim Sistemi
UFUK AVRUPA Projesi, UFUK AVRUPA Projesi, 2025 - 2028
Today’s electronics are smaller and faster because of improved assembly and packaging technologies. This is crucial for incorporating more functions into compact devices. With this in mind, the EU-funded E2PackMan project aims to improve the production ecosystem in Europe. It brings together partners from 13 countries and links major semiconductor manufacturers with small and medium-sized enterprises to develop improved materials, processes, and equipment for packaging. The project covers the entire value chain, from materials research to test-build validation. The project’s main goal is to increase industrial capacity, support innovation, and maintain Europe’s leading position in modern microelectronics.