Zafer, B. Et Al. 2013. Wafer test probe burn modeling and characterization. 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) , (Wroclaw, Poland).

Zafer, B., Vishkasougheh, M. H., & Tunaboylu, B., (2013). Wafer test probe burn modeling and characterization . 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Wroclaw, Poland

Zafer, Baha, Mehdi H. Vishkasougheh, And BAHADIR TUNABOYLU. "Wafer test probe burn modeling and characterization," 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Wroclaw, Poland, 2013

Zafer, Baha Et Al. "Wafer test probe burn modeling and characterization." 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) , Wroclaw, Poland, 2013

Zafer, B. Vishkasougheh, M. H. And Tunaboylu, B. (2013) . "Wafer test probe burn modeling and characterization." 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) , Wroclaw, Poland.

@conferencepaper{conferencepaper, author={Baha Zafer Et Al. }, title={Wafer test probe burn modeling and characterization}, congress name={14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, city={Wroclaw}, country={Poland}, year={2013}}