Genç, G. Et Al. 2020. Luffa/Epoxy Composites: Electrical Properties for PCB Application. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY , vol.10, no.6 , 933-940.

Genç, G., Sarıkaş, A., Kesen, U., & Aydın, S., (2020). Luffa/Epoxy Composites: Electrical Properties for PCB Application. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY , vol.10, no.6, 933-940.

Genç, GARİP Et Al. "Luffa/Epoxy Composites: Electrical Properties for PCB Application," IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY , vol.10, no.6, 933-940, 2020

Genç, GARİP Et Al. "Luffa/Epoxy Composites: Electrical Properties for PCB Application." IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY , vol.10, no.6, pp.933-940, 2020

Genç, G. Et Al. (2020) . "Luffa/Epoxy Composites: Electrical Properties for PCB Application." IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY , vol.10, no.6, pp.933-940.

@article{article, author={GARİP GENÇ Et Al. }, title={Luffa/Epoxy Composites: Electrical Properties for PCB Application}, journal={IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY}, year=2020, pages={933-940} }