Tunaboylu, B. 2012. Testing of Copper Pillar Bumps for Wafer Sort. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY , vol.2, no.6 , 985-993.

Tunaboylu, B., (2012). Testing of Copper Pillar Bumps for Wafer Sort. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY , vol.2, no.6, 985-993.

Tunaboylu, BAHADIR. "Testing of Copper Pillar Bumps for Wafer Sort," IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY , vol.2, no.6, 985-993, 2012

Tunaboylu, BAHADIR. "Testing of Copper Pillar Bumps for Wafer Sort." IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY , vol.2, no.6, pp.985-993, 2012

Tunaboylu, B. (2012) . "Testing of Copper Pillar Bumps for Wafer Sort." IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY , vol.2, no.6, pp.985-993.

@article{article, author={BAHADIR TUNABOYLU}, title={Testing of Copper Pillar Bumps for Wafer Sort}, journal={IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY}, year=2012, pages={985-993} }